Advanced Logic Manufacturing Solution

Application

Description

Complete etching and deposition solution for advanced logic device manufacturing including FinFET and GAA transistor fabrication

Core Advantages

Atomic-Level Precision Advanced plasma control enables atomic-level precision for critical dimension control in advanced node devices
Multi-Patterning Support Comprehensive support for SADP, SAQP, and other multi-patterning schemes required for sub-7nm devices
High Selectivity Proprietary process chemistry delivers high selectivity for precise etch stop control
Production Proven Qualified and in production at leading logic fabs worldwide
Integrated Support Complete support from equipment to process optimization from AMEC and authorized distributor

Recommended Bill of Materials (BOM)

Item Part Number Description Quantity Datasheet
1 Primo AD-RIE Dielectric etching system 4 📄 Download
2 Primo SSC Silicon etching system 4 📄 Download
3 Primo iDEA CVD deposition system 3 📄 Download
4 Automation System Wafer handling automation 1 📄 Download

Applications

FinFET transistors
Gate-All-Around (GAA) transistors
Advanced interconnects
Contact and via etching

Technical Specifications

Technology Node Support
3nm - 28nm
Wafer Size
300mm
Etch Rate Uniformity
< ±3% (3σ)
Critical Dimension Control
< ±2nm (3σ)
Selectivity
> 20:1 (oxide to silicon)
Throughput
> 100 wafers/hour
Uptime
> 90%
Particle Performance
< 0.1 adders/wafer

Customer Success Stories

Leading Asian Foundry

Semiconductor Manufacturing | 5nm Logic Production

Challenge

The customer needed to ramp 5nm production with stringent requirements for critical dimension control and defect density. Existing equipment had limitations in uniformity and selectivity for advanced multi-patterning processes.

Solution

AMEC provided a complete solution including 8 etching systems and 3 deposition systems. Our process team worked closely with the customer to develop optimized recipes for fin etching, gate etching, and contact etching. Extensive process matching ensured consistent results across all chambers.

Results

The customer achieved successful 5nm ramp with yield targets met within 6 months. CD uniformity improved by 25% compared to previous generation equipment. Defect density met aggressive targets for high-volume production. The customer has since expanded with additional AMEC equipment.

Major Memory Manufacturer

Memory Manufacturing | Advanced DRAM Production

Challenge

DRAM capacitor etching required extreme aspect ratios (>50:1) with straight profiles and minimal bowing. Existing equipment struggled with profile control and repeatability at these extreme dimensions.

Solution

AMEC deployed Primo SSC systems optimized for high aspect ratio etching. Custom process development addressed the specific requirements for capacitor etching. Chamber matching and process control algorithms ensured wafer-to-wafer consistency.

Results

The customer achieved >50:1 aspect ratios with straight profiles and <2% bowing. Yield improved by 15% compared to previous equipment. Production throughput met capacity targets. The solution is now standard for new DRAM generations.

FAE Expert Insights

D

Dr. James Chen

Principal FAE - Etching Technology

20 years

Professional Insights

Key considerations: Atomic-level precision is essential for advanced node manufacturing; Multi-patterning support is critical for sub-7nm devices; Process integration expertise is as important as equipment capability; Chamber matching ensures consistent results across high-volume production; Total cost of ownership must include yield impact, not just equipment cost. Common pitfalls to avoid: Focusing only on equipment specifications without considering process integration; Underestimating the importance of chamber matching in multi-chamber configurations; Not planning for process development time in the project schedule; Overlooking the impact of consumables cost on total cost of ownership.

Key Takeaways

  • Atomic-level precision is essential for advanced node manufacturing
  • Multi-patterning support is critical for sub-7nm devices
  • Process integration expertise is as important as equipment capability
  • Chamber matching ensures consistent results across high-volume production
  • Total cost of ownership must include yield impact, not just equipment cost

Decision Framework

Solution Selection Decision Framework
Steps:
  1. Evaluate application requirements and performance metrics
  2. Compare solution advantages considering cost and supply chain
  3. Reference success cases and customer feedback
  4. Consult FAE for professional recommendations

Ready to Implement This Solution?

Contact our FAE team for design support and quotes

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Frequently Asked Questions

What technology nodes does this solution support?

The Advanced Logic Manufacturing Solution supports technology nodes from 28nm down to 3nm and below. AMEC's Primo AD-RIE and Primo SSC systems are qualified and in production at leading fabs for 7nm, 5nm, and 3nm processes. The equipment features advanced plasma control, precise temperature management, and sophisticated process monitoring required for atomic-level precision. For nodes below 3nm, AMEC continues to develop next-generation equipment with enhanced capabilities. Contact our FAE team for specific node capability discussions and roadmap information.

AMEC supports 3nm through 28nm nodes. Contact FAE for specific node requirements and roadmap.

How does AMEC handle multi-patterning requirements?

AMEC's solution comprehensively supports multi-patterning schemes including SADP (Self-Aligned Double Patterning), SAQP (Self-Aligned Quadruple Patterning), and LELE (Litho-Etch-Litho-Etch). Key capabilities include: 1) Spacer etching with precise profile control for SADP/SAQP, 2) High selectivity to enable precise etch stop on mandrel layers, 3) Excellent CD uniformity for consistent spacer width, 4) Low defect density to prevent pattern defects, 5) Process control algorithms for consistent results across wafers. AMEC has extensive experience with multi-patterning processes at advanced nodes and provides proven recipes and process integration support.

AMEC provides comprehensive multi-patterning support with proven processes at advanced nodes.

What is the typical chamber matching performance?

AMEC specifies and achieves chamber-to-chamber matching within +/- 1% for critical parameters. Typical performance includes: 1) Etch rate matching within 1-2% across all chambers, 2) Uniformity matching within 0.5% variation, 3) Critical dimension matching within 2-3%, 4) Selectivity matching for consistent etch stop behavior. AMEC achieves this through precise hardware manufacturing, automated chamber qualification, and sophisticated matching algorithms. For high-volume manufacturing, excellent chamber matching enables load balancing and ensures consistent results regardless of which chamber processes the wafer. Factory acceptance testing includes chamber matching validation.

AMEC achieves industry-leading chamber matching within +/- 1%. Essential for high-volume production.

How long does process development typically take?

Process development timeline varies by complexity: 1) Simple process transfer - 2-4 weeks for adapting existing recipes to AMEC equipment, 2) New process development - 2-3 months for developing optimized recipes for new applications, 3) Complex integration - 3-6 months for multi-step processes with tight integration requirements, 4) Advanced node development - 6-12 months for cutting-edge processes requiring extensive optimization. AMEC provides process development support including recipe development, optimization, and troubleshooting. Timeline can be accelerated with close collaboration and clear requirements definition. Production ramp typically follows successful process qualification.

Process development ranges from weeks to months depending on complexity. AMEC provides comprehensive development support.

What support is provided during production ramp?

AMEC provides comprehensive production ramp support including: 1) On-site process engineers during initial production, 2) Real-time troubleshooting and optimization, 3) Yield analysis and improvement support, 4) Regular performance reviews and optimization, 5) Escalation support for critical issues, 6) Continuous improvement programs. Support can be provided under service contracts with defined response times and support levels. For critical production ramps, AMEC can provide dedicated on-site support teams. The goal is to achieve stable production as quickly as possible and maintain high performance throughout the production lifecycle.

Comprehensive ramp support ensures successful production startup. Service contracts provide ongoing support.

How does AMEC ensure process stability over time?

AMEC ensures long-term process stability through: 1) Robust hardware design with minimal drift, 2) Advanced process control with real-time monitoring and adjustment, 3) Predictive maintenance algorithms to prevent issues before they impact process, 4) Regular calibration and qualification procedures, 5) Chamber cleaning and conditioning protocols, 6) Statistical process control (SPC) for monitoring trends. AMEC systems are designed for high availability and consistent performance over years of production. Typical uptime exceeds 90% with proper maintenance. Process drift is minimized through hardware stability and automated control systems.

AMEC systems designed for long-term stability with advanced process control and predictive maintenance.