AMEC (Advanced Micro-Fabrication Equipment Inc.) Products

AMEC offers four main equipment categories: 1) Etching Equipment - plasma etching systems for dielectric, silicon, and metal etching applications in advanced logic and memory manufacturing. 2) Thin Film Deposition - CVD and PVD systems for depositing dielectric films, metal layers, and barrier films. 3) MOCVD Systems - metal organic chemical vapor deposition systems for LED epitaxy and compound semiconductor manufacturing. 4) Process Solutions - integrated solutions combining multiple equipment types with process support. Selection depends on your manufacturing process requirements, technology node, wafer size, and production volume. Contact our FAE team for detailed equipment selection guidance.

Identify your process requirements first, then select the appropriate equipment category. Contact FAE for detailed selection support.

Dielectric etching and silicon etching differ in process requirements and equipment configuration: 1) Dielectric etching - used for etching oxide, nitride, and other insulating materials. Requires high selectivity to silicon, anisotropic profiles for contact and via formation. Typically uses fluorocarbon chemistry. 2) Silicon etching - used for etching silicon substrates, polysilicon gates, and silicon trenches. Requires precise profile control, high selectivity to oxide masks, and smooth sidewalls. Uses chlorine or bromine-based chemistry. 3) Equipment differences - dielectric etchers often use different plasma sources and chamber configurations than silicon etchers. AMEC provides specialized equipment optimized for each application type, with some systems offering multi-process capability.

Select dielectric etcher for oxide/nitride processing. Select silicon etcher for substrate and gate etching. Some systems support both.

Etching equipment selection by process node: 1) Advanced nodes (7nm and below) - require atomic-level precision, advanced plasma control, and multi-patterning support. AMEC's latest generation etchers are qualified for these nodes. 2) Mature nodes (14nm-65nm) - balance of performance and cost, AMEC offers proven platforms with high productivity. 3) Legacy nodes (90nm and above) - cost-effective solutions with proven reliability. Key considerations: critical dimension control, uniformity requirements, selectivity specifications, and defect density targets. AMEC's equipment portfolio spans all technology nodes with optimized configurations for each. Our FAE team can help match equipment capabilities to your specific process requirements.

Match equipment generation to process node requirements. Consider CD control, uniformity, and productivity needs.

MOCVD system selection parameters: 1) Wafer size and capacity - AMEC offers systems for 2-inch to 8-inch wafers with various reactor configurations. 2) Process requirements - LED wavelength, power device specifications, or RF device requirements determine reactor design. 3) Throughput - wafer-per-hour requirements affect reactor size and automation level. 4) Uniformity specifications - thickness and composition uniformity requirements for your application. 5) Material systems - GaN, GaAs, InP, or other compound semiconductor materials. 6) Footprint and facilities - cleanroom space, gas supply, and exhaust requirements. AMEC's MOCVD systems are known for high uniformity, high productivity, and low cost of ownership. Calculate total cost of ownership including consumables, maintenance, and yield impact.

Match reactor configuration to wafer size and throughput requirements. Consider uniformity specifications and material systems.

Total cost of ownership (TCO) evaluation for AMEC equipment: 1) Capital cost - equipment purchase price including installation and training. AMEC typically offers 20-30% lower capital cost than competitors. 2) Operating cost - consumables, utilities, and maintenance costs. AMEC equipment is designed for efficient operation with reasonable consumable costs. 3) Productivity - throughput and uptime directly affect cost per wafer. AMEC systems offer competitive throughput and reliability. 4) Maintenance - spare parts availability and service costs. AMEC provides competitive service packages. 5) Yield impact - process performance affects overall manufacturing cost. AMEC equipment delivers competitive yields. 6) Upgrade path - future upgrade costs and equipment longevity. AMEC supports equipment upgrades to extend useful life. Our FAE team can help develop detailed TCO comparisons.

Evaluate all cost factors including capital, operating, and maintenance costs. AMEC typically offers competitive TCO compared to alternatives.

Facilities requirements for AMEC equipment: 1) Cleanroom - Class 1000 or better depending on process requirements. Temperature and humidity control within specified ranges. 2) Power - stable power supply with appropriate voltage and capacity. UPS systems recommended for critical processes. 3) Process gases - high-purity gas supply systems with appropriate safety features. Gas detection and exhaust systems. 4) Exhaust - acid exhaust for corrosive byproducts, general exhaust for heat removal. 5) Cooling water - temperature-controlled cooling water for equipment thermal management. 6) Compressed air - clean dry air for pneumatic systems. 7) Floor loading - adequate floor strength for equipment weight. AMEC provides detailed facilities requirements for each equipment type during the planning phase.

Review facilities requirements early in planning. AMEC provides detailed specifications and can assist with facilities planning.