Primo AD-RIE
Dual-frequency CCP etching system for advanced dielectric etching with high selectivity and excellent uniformity.
Product Overview
Description
The Primo AD-RIE is AMEC's advanced dielectric etching system designed for high-volume manufacturing of logic and memory devices. The dual-frequency CCP configuration provides independent control of ion flux and ion energy, enabling precise profile control and high selectivity.
This system supports technology nodes down to 5nm and below, with proven performance in contact, via, and trench etching applications. The proprietary plasma source design delivers excellent uniformity across 300mm wafers, critical for advanced multi-patterning processes.
Advanced process control features include real-time endpoint detection, chamber matching algorithms, and automated process optimization. The high-productivity platform supports multiple chamber configurations to meet various throughput requirements.
Product Series
Primo
Primary Application
Contact Etching
Key Features
- High efficiency and reliability
- Optimized for industrial applications
- Comprehensive technical support
- Available from stock
Specifications
| Wafer Size | 300mm |
|---|---|
| Technology Node | 5nm and below |
| Plasma Source | Dual-frequency CCP |
| RF Configuration | 60MHz + 2MHz |
| Uniformity | < ±3% (3σ) |
| Selectivity | > 20:1 (oxide to silicon) |
| Throughput | > 120 wafers/hour |
| Footprint | 3.2m x 4.5m (cluster configuration) |
Applications
Contact Etching
Electronic system design
Via Etching
Electronic system design
Trench Etching
Electronic system design
Hard Mask Etching
Electronic system design
Spacer Etching
Electronic system design
FAE Expert Insights
"The Primo AD-RIE is AMEC's most advanced dielectric etching platform. I have worked with multiple customers who have successfully qualified this system for their most demanding processes. The dual-frequency CCP configuration provides exceptional flexibility - the high frequency controls plasma density while the low frequency controls ion bombardment energy. This enables optimization for various applications from soft low-k dielectric etching to hard mask patterning. The uniformity performance is excellent, consistently achieving less than 3% variation across the wafer. For advanced nodes, the system's chamber matching capability is crucial - multiple chambers can be matched to within 1% for consistent results across a fab. I particularly appreciate the intuitive user interface and comprehensive data logging, which makes process development and troubleshooting much more efficient. For high-volume manufacturing, the high uptime and reasonable maintenance requirements make this a very cost-effective solution."
Dual-frequency CCP technology with excellent uniformity for advanced node manufacturing
— Dr. James Chen, BeiLuo
Frequently Asked Questions
What process applications is the Primo AD-RIE best suited for?
The Primo AD-RIE excels in advanced dielectric etching applications including: 1) Contact etching - high aspect ratio contact holes with excellent bottom profile control. 2) Via etching - precise via formation for multi-level interconnects with high selectivity to underlying metals. 3) Trench etching - shallow and deep trench applications for isolation and capacitor structures. 4) Hard mask etching - precise pattern transfer for multi-patterning applications. 5) Spacer etching - formation of sidewall spacers for self-aligned processes. The dual-frequency CCP configuration makes it particularly suitable for applications requiring precise control of etch profile and selectivity. For advanced nodes, the system supports complex multi-patterning schemes including SADP and SAQP.
AD-RIE is ideal for advanced dielectric etching applications. Contact FAE to discuss specific process requirements.
How does the dual-frequency CCP technology improve process control?
Dual-frequency CCP technology provides independent control of plasma parameters: 1) High frequency (60MHz) primarily controls plasma density - higher frequency generates higher electron density and higher ion flux. 2) Low frequency (2MHz) primarily controls ion bombardment energy - lower frequency ions have higher energy due to less sheath filtering. 3) Independent tuning - by adjusting the power ratio between frequencies, process engineers can optimize the trade-off between etch rate, selectivity, and profile control. 4) Process flexibility - the same chamber can be optimized for different applications by adjusting frequency parameters. 5) Damage reduction - lower ion energy can be used for delicate materials while maintaining reasonable etch rates. This independent control is crucial for advanced applications where multiple process requirements must be balanced.
Dual-frequency CCP provides maximum process flexibility. Work with FAE to optimize frequency parameters for your application.
What is the typical chamber matching performance for multi-chamber configurations?
Chamber matching performance for Primo AD-RIE multi-chamber systems: AMEC specifies chamber-to-chamber matching within +/- 1% for critical parameters. Typical results show: 1) Etch rate matching - within 1-2% across all chambers in a cluster. 2) Uniformity matching - within 0.5% variation in uniformity profiles. 3) Profile matching - critical dimensions match within 2-3% across chambers. 4) Selectivity matching - consistent selectivity performance across all chambers. AMEC achieves this through: precise hardware manufacturing tolerances, automated chamber qualification procedures, and sophisticated chamber matching algorithms. For high-volume manufacturing, excellent chamber matching enables load balancing across chambers and ensures consistent results regardless of which chamber processes the wafer. This is essential for maintaining yield in large-scale production.
Excellent chamber matching enables consistent results across multi-chamber systems. AMEC's matching performance is industry-leading.
How does the real-time endpoint detection system work?
The Primo AD-RIE endpoint detection system uses multiple techniques: 1) Optical emission spectroscopy (OES) - monitors plasma emission spectrum changes as etch completes. Different materials emit characteristic wavelengths when etched. 2) Laser interferometry - measures film thickness in real-time using laser reflection interference patterns. 3) RF impedance monitoring - detects changes in plasma impedance as underlying layers are exposed. 4) Combination algorithms - advanced software combines multiple signals for robust endpoint detection. Benefits include: improved process control by stopping at the correct layer, reduced over-etch damage to underlying materials, better uniformity by compensating for wafer-to-wafer variations, and increased productivity by minimizing over-etch time. The system can be configured for different endpoint strategies including timed over-etch, percentage of main etch, or absolute signal levels.
Multiple endpoint detection methods ensure reliable process control. Configure endpoint strategy based on process requirements.
What maintenance requirements and intervals are typical for AD-RIE systems?
Primo AD-RIE maintenance schedule: 1) Daily - visual inspections, gas leak checks, basic cleaning. 2) Weekly - chamber pressure checks, RF calibration verification. 3) Monthly - detailed chamber inspection, consumable wear assessment, preventive maintenance tasks. 4) Quarterly - major chamber cleaning, component replacement as needed, comprehensive system calibration. 5) Annually - major overhaul including critical component replacement. Key consumables include: chamber liners, focus rings, gas distribution plates, and RF components. AMEC designs the system for reasonable maintenance intervals to maximize uptime. Typical availability exceeds 90% with proper maintenance. AMEC provides comprehensive maintenance training and detailed procedures. Spare parts are stocked regionally for quick response. Predictive maintenance algorithms help optimize maintenance scheduling based on actual usage.
Follow AMEC's recommended maintenance schedule for optimal uptime. AMEC provides comprehensive maintenance support and training.