Hangshun General Purpose MCU

Selecting the right General Purpose MCU involves evaluating several parameters: 1) Core performance - Choose Cortex-M0 (up to 48MHz) for simple control tasks, M3 (up to 72MHz) for medium complexity with hardware divide, or M4 (up to 168MHz) for DSP/FPU requirements

2) Memory size - Flash from 32KB (simple applications) to 512KB (complex firmware)

SRAM from 4KB to 128KB based on runtime data needs

3) Peripherals - Count required interfaces: UART for serial communication, SPI/I2C for sensors, USB for PC connectivity, CAN for industrial networks, Ethernet for networking

4) ADC requirements - 12-bit for general use, 16-bit for precision measurement

5) Package - QFN for compact designs, LQFP for easy prototyping, TSSOP for cost-sensitive applications

6) Power - Check active and sleep current for battery applications. Use the parametric search table to filter by these criteria.

Use the parametric table to filter by core type, memory size, and peripherals; contact our FAEs for complex selection requirements.

The HS32F103 and HS32F405 are two popular General Purpose MCU series with different target applications: HS32F103 series features Cortex-M3 core at 72MHz, 64KB-512KB Flash, 20KB-96KB SRAM, and is pin-to-pin compatible with STM32F103. It includes USB, CAN, and up to 3 ADCs. Best for industrial control, consumer electronics, and cost-sensitive applications. HS32F405 series features Cortex-M4 core at 168MHz with FPU, 512KB-1MB Flash, 128KB-192KB SRAM, and includes USB OTG, Ethernet, DCMI interface, and advanced timers. It offers significantly higher performance for DSP applications, complex algorithms, and graphics processing. HS32F103 is ideal when you need proven reliability at lower cost

HS32F405 is preferred for high-performance requirements. Both series maintain software compatibility through HAL libraries.

Choose HS32F103 for cost-effective industrial applications; select HS32F405 for high-performance DSP and complex processing needs.

Migrating from STM32 to Hangshun MCU is straightforward due to architectural compatibility: 1) Pin compatibility - Many Hangshun MCUs are pin-to-pin compatible with STM32 (e.g., HS32F103 with STM32F103)

check the pinout table for exact mapping

2) Software compatibility - Hangshun provides HAL libraries with similar APIs to STM32 HAL

register structures are compatible for direct register access

3) Development tools - Use the same Keil MDK, IAR, or GCC toolchains

no need to change IDE

4) Peripheral configuration - Clock tree and peripheral initialization are similar

review clock configuration for any differences

5) Code migration - Most application code requires minimal changes

focus on startup files and linker scripts

6) Testing - Verify timing-critical code as there may be slight timing differences. BeiLuo provides migration guides and technical support to ensure smooth transition. Typical migration effort is 1-2 weeks for established projects.

Contact our FAEs for migration support; we provide pin compatibility tables and code migration guides.

Hangshun General Purpose MCUs are available in multiple package types to suit different application requirements: 1) QFN packages - QFN32 (5x5mm), QFN48 (6x6mm), QFN64 (8x8mm), QFN100 (12x12mm)

smallest footprint, excellent thermal performance, requires careful PCB design

2) LQFP packages - LQFP48 (7x7mm), LQFP64 (10x10mm), LQFP100 (14x14mm), LQFP144 (20x20mm)

easy for prototyping and hand soldering, good pin accessibility

3) TSSOP packages - TSSOP20 (6.5x4.4mm), TSSOP28, TSSOP38

cost-effective for low-pin-count applications

4) LGA/BGA - Available for high-pin-count applications requiring smallest form factor. Package selection considerations: PCB space constraints, manufacturing capability (hand vs automated assembly), thermal requirements, and cost. QFN offers best size/performance ratio

LQFP is preferred for development and low-volume production.

Choose QFN for compact designs, LQFP for prototyping and easy assembly, TSSOP for cost-sensitive low-pin applications.

Hangshun General Purpose MCUs offer competitive power consumption across all operating modes: Active mode - Cortex-M0: ~100μA/MHz, M3: ~150μA/MHz, M4: ~200μA/MHz at typical conditions (3.3V, 25°C)

Sleep mode - CPU stopped, peripherals running: 50-200μA depending on enabled peripherals

Deep sleep - RAM retained, wake-up from interrupt: 5-20μA

Standby - lowest power with wake-up from reset: 1-5μA. Power optimization features: Multiple clock sources (HSI, HSE, PLL) with dynamic switching

Peripheral clock gating to disable unused modules

Voltage regulator modes (run, low-power, shutdown)

Flash wait state optimization

Brown-out reset with configurable threshold. For battery-powered applications, consider: Lower operating frequency, Use sleep modes between tasks, Disable unused peripherals, Optimize clock tree configuration. Actual power consumption depends on application code, enabled peripherals, and operating voltage.

Use sleep modes and clock gating for battery applications; contact our FAEs for power optimization recommendations.