DOSILICON MCP Multi-Chip Package

About MCP Multi-Chip Package

Integrated multi-chip package solutions combining different memory types for space-constrained applications.

As an authorized distributor of DOSILICON, BeiLuo provides a comprehensive range of MCP Multi-Chip Package products. These products are widely used in industrial control, automotive electronics, consumer electronics, and communication equipment. We offer a complete product line with multiple series to meet various application requirements. All products are genuine and original, backed by professional technical support and comprehensive after-sales service.

Selection Guide: How to Choose the Right MCP Multi-Chip Package

Product List

3 products available

Part Number ↕	Configuration ↕	NOR Interface ↕	NAND Interface ↕	NOR Endurance ↕	NAND Endurance ↕	Package ↕	Stock Status	Action
DSMCP32N2G	32Mb NOR + 2Gb NAND	SPI, 66MHz	SPI, 80MHz	100,000 cycles	100,000 cycles	WSON-8 (8x6mm)	In Stock	View Details
DSMCP64N4G	64Mb NOR + 4Gb NAND	SPI, 80MHz	SPI, 100MHz	-	-	WSON-8 (8x6mm)	In Stock	View Details
DATA_PENDING	-	-	-	-	-	-	In Stock	View Details

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Frequently Asked Questions

What MCP configurations does DOSILICON offer?

DOSILICON offers various MCP configurations: (1) NOR+NAND - Combines SPI NOR flash for boot code with SPI NAND flash for data storage. Most popular configuration for embedded systems. (2) NOR+NOR - Stacked NOR flash dies for very high-density code storage. Used when code size exceeds single die capacity. (3) NOR+SRAM - Combines non-volatile storage with fast volatile memory. (4) Custom Configurations - Contact DOSILICON for specific memory combinations. Common densities: NOR+NAND with 32Mb NOR + 2Gb NAND, 64Mb NOR + 4Gb NAND. The NOR+NAND combination is ideal for systems requiring both boot storage and large data storage in minimal space. LiTong can help select optimal MCP configuration for your application.

Contact LiTong for MCP configuration selection and design guidance.

What are the space savings of MCP compared to discrete devices?

MCP provides significant space savings: (1) PCB Area - MCP typically uses 50-70% less PCB area than equivalent discrete devices. (2) Package Comparison: Single WSON-8 MCP vs. two separate WSON-8 packages saves one package footprint plus routing space. (3) Routing - Reduced PCB routing complexity

shared control signals between dies. (4) Assembly - Single pick-and-place operation vs. multiple components. (5) Example - 32Mb NOR + 2Gb NAND MCP in 8x6mm WSON vs. two packages totaling 12x10mm area. (6) Height - MCP height comparable to single package

thinner than stacked discrete packages. Space savings are most significant for: Wearables, Smartphones, IoT sensors, Portable electronics. The integration also improves reliability by reducing interconnections.

Contact LiTong for space analysis and MCP sizing for your design.

How do I interface with MCP devices?

Interfacing with DOSILICON MCP devices: (1) Shared Interface - Both dies share common SPI signals (SCK, CS#, SI, SO). (2) Die Selection - Separate CS# pins or internal address decoding selects active die. (3) Standard Commands - Each die responds to standard SPI flash commands for its type. (4) Independent Operation - NOR and NAND can be accessed independently

no interference between dies. (5) Software - Treat as separate devices in software

standard flash drivers work without modification. (6) Hardware - Connect shared signals to processor SPI port

route separate CS# signals. The interface is straightforward and compatible with existing SPI flash controllers. No special drivers or complex software required.

Contact LiTong for MCP interface design and software integration.

What are the cost benefits of using MCP?

MCP cost benefits include: (1) Component Cost - MCP often costs less than equivalent discrete devices due to reduced packaging and testing overhead. (2) Assembly Cost - Single component placement vs. multiple components reduces manufacturing cost. (3) PCB Cost - Smaller PCB area reduces board cost, especially for multi-layer boards. (4) BOM Simplification - Fewer line items simplify procurement and inventory management. (5) Yield Improvement - Single component has better manufacturing yield than multiple components. (6) Design Cost - Simplified PCB layout reduces design time and cost. Overall system cost savings typically 10-20% compared to discrete solutions. Cost benefits increase with production volume. For high-volume consumer applications, MCP offers compelling cost advantages.

Contact LiTong for cost analysis and MCP pricing.

When should I choose MCP over discrete memory?

Choose MCP over discrete memory when: (1) Space Constrained - Board area is limited and every mm² counts. (2) High Volume - Production volumes justify optimization for size and cost. (3) Mobile Applications - Wearables, smartphones, portable devices where size is critical. (4) Simplified Design - Want to reduce component count and design complexity. (5) Cost Optimization - System cost reduction is a priority. Choose discrete when: (1) Flexibility - Need to mix different suppliers or change memory independently. (2) Low Volume - Development cost of MCP integration not justified. (3) Special Requirements - Need specific memory combinations not available in MCP. (4) Upgrade Path - Want ability to upgrade one memory type independently. MCP is optimal for size-sensitive, high-volume consumer applications. Discrete offers more flexibility for low-volume or specialized applications.

Contact LiTong for MCP vs. discrete analysis for your application.