DSMCP32N2G
Multi-chip package combining 32Mb SPI NOR flash for code storage with 2Gb SPI NAND flash for data storage in c...
Product Overview
Description
The DSMCP32N2G is a multi-chip package integrating 32Mb SPI NOR flash and 2Gb SPI NAND flash in a single compact WSON-8 package. This configuration provides complete memory solution for embedded systems requiring both boot code storage and large data storage.
The NOR flash provides fast random access for boot code execution and firmware storage, while the NAND flash offers high-density, cost-effective storage for application data, file systems, and logs. Both dies share common SPI interface with separate chip select signals.
Ideal for space-constrained applications such as wearables, IoT devices, and portable electronics where PCB area is limited. The integrated solution reduces component count, simplifies assembly, and improves reliability.
Product Series
DSMCP
Primary Application
Wearable devices
Key Features
- 32Mb NOR + 2Gb NAND in single package
- Shared SPI interface
- Separate chip select signals
- Fast NOR for boot code
- High-density NAND for data
- 50% PCB area savings vs discrete
- Simplified BOM and assembly
- WSON-8 compact package
Specifications
| Configuration | 32Mb NOR + 2Gb NAND |
|---|---|
| NOR Interface | SPI, 66MHz |
| NAND Interface | SPI, 80MHz |
| NOR Endurance | 100,000 cycles |
| NAND Endurance | 100,000 cycles |
| Data Retention | 20 years (NOR), 10 years (NAND) |
| Package | WSON-8 (8x6mm) |
Applications
Wearable devices
Electronic system design
IoT sensors
Sensor signal conditioning
Portable electronics
Electronic system design
Smart home devices
Electronic system design
Industrial IoT
Industrial automation and control
FAE Expert Insights
"The DSMCP32N2G is an excellent MCP solution for space-constrained designs. The 32Mb NOR provides ample space for boot code and RTOS, while the 2Gb NAND handles data logging and file systems. I've used this part in several wearable and IoT designs with great results. The space savings are significant - we saved about 60% of memory footprint compared to discrete solutions. Key design tips: Route CS# signals carefully to avoid crosstalk; use series resistors on shared SPI lines for signal integrity. The shared interface works seamlessly with standard SPI flash drivers - just treat as two separate devices in software. Power consumption is lower than discrete due to reduced I/O activity. For high-volume consumer applications, the cost savings are substantial. Overall, this MCP offers an optimal balance of density, performance, and size."
Compact MCP solution combining NOR and NAND for complete memory subsystem
— Michael Chen, BeiLuo
Frequently Asked Questions
How do I access NOR and NAND in the MCP?
Accessing NOR and NAND in DSMCP32N2G MCP: (1) Shared Signals - SCK, SI, SO are shared between both dies. (2) Separate CS# - NOR_CS# and NAND_CS# select active die. Assert one CS# at a time. (3) Independent Operation - Each die operates independently with standard SPI flash commands. (4) Software Interface - Configure two separate flash drivers or instances in software. (5) Hardware Connection - Connect shared signals to processor SPI port; connect separate CS# to GPIO pins. (6) Simultaneous Access - Cannot access both dies simultaneously; serialize operations. Example sequence: Assert NOR_CS#, send NOR commands, deassert NOR_CS#, assert NAND_CS#, send NAND commands. Standard SPI flash software works without modification.
Contact LiTong for MCP software integration and driver development.
What is the power consumption of the MCP?
DSMCP32N2G MCP power consumption: (1) Active Read (NOR) - ~10mA at 66MHz during NOR read operations. (2) Active Read (NAND) - ~15mA at 80MHz during NAND read operations. (3) Program/Erase - ~20mA during program or erase operations on either die. (4) Standby - ~60μA when both dies deselected. (5) Deep Power-Down - ~10μA when both dies in power-down mode. (6) Power Savings - Lower than discrete due to shared I/O drivers and optimized internal routing. For power-sensitive applications: Use standby mode when memory not needed, Put unused die in power-down mode, Minimize active operation time. Overall power consumption is comparable to or better than equivalent discrete devices.
Contact LiTong for power analysis and battery life estimation.
Can I use different voltages for NOR and NAND?
DSMCP32N2G MCP voltage requirements: (1) Common Voltage - Both dies share common VCC supply (2.7V-3.6V). (2) Single Supply - MCP designed for single-supply operation; cannot use different voltages for each die. (3) I/O Voltage - SPI interface levels match VCC. (4) Level Shifting - If processor uses different voltage, implement level shifters on SPI signals. (5) Power Sequencing - No special sequencing required; both dies power up together. (6) Decoupling - Use adequate decoupling capacitors close to VCC pins. The common voltage design simplifies power supply design. For systems requiring voltage translation, external level shifters can be used on the SPI interface.
Contact LiTong for power supply design and voltage translation.
What is the thermal performance of MCP?
DSMCP32N2G MCP thermal performance: (1) Package Thermal Resistance - θJA approximately 40-50°C/W in typical PCB conditions. (2) Heat Distribution - Heat from both dies distributed through common package and PCB. (3) Temperature Range - Industrial grade (-40°C to +85°C) ambient operation. (4) Self-Heating - Minimal due to low power consumption; typically <5°C temperature rise. (5) PCB Design - Use thermal vias under package, adequate copper area for heat spreading. (6) Thermal Management - Generally no special cooling required for normal operation. The compact package has good thermal performance due to exposed pad design. For high-temperature environments, ensure adequate PCB heat sinking.
Contact LiTong for thermal analysis and PCB design guidance.
How reliable is MCP compared to discrete devices?
DSMCP32N2G MCP reliability: (1) Equivalent Reliability - Individual die reliability same as discrete devices. (2) Interconnect Reliability - Internal wire bonds eliminate external interconnections, improving reliability. (3) Mechanical Robustness - Single package more robust than multiple discrete packages. (4) Testing - 100% tested at wafer and final test; same standards as discrete. (5) Endurance - NOR: 100K cycles, NAND: 100K cycles - same as discrete. (6) Data Retention - NOR: 20 years, NAND: 10 years - same as discrete. (7) Failure Modes - Independent; failure of one die does not affect the other. Overall reliability is equal to or better than equivalent discrete solution due to reduced interconnections and simplified assembly.
Contact LiTong for reliability specifications and MTBF data.