Primo PVD
High-performance PVD system for metal film deposition with excellent uniformity and film purity.
Product Overview
Description
The Primo PVD is AMEC's physical vapor deposition system designed for high-quality metal film deposition in semiconductor manufacturing. The system features advanced magnetron sputtering technology for excellent film properties.
This system supports deposition of various metal films including aluminum, copper, titanium, tantalum, and metal alloys for interconnect and barrier layer applications. The directional deposition capability enables gap fill and bottom coverage in vias and contacts.
The system supports 300mm wafer processing with high throughput. Advanced features include target utilization optimization, in-situ pre-clean capability, and comprehensive process monitoring for consistent film quality.
Product Series
Primo
Primary Application
Interconnect Metallization
Key Features
- High efficiency and reliability
- Optimized for industrial applications
- Comprehensive technical support
- Available from stock
Specifications
| Wafer Size | 300mm |
|---|---|
| Film Types | Al, Cu, Ti, Ta, TiN, TaN, Alloys |
| Deposition Technology | DC Magnetron Sputtering |
| Temperature Range | Room temp to 500°C |
| Uniformity | < ±5% (1σ) |
| Target Utilization | > 40% |
| Base Pressure | < 5 x 10^-7 Torr |
| Throughput | > 60 wafers/hour |
Applications
Interconnect Metallization
Electronic system design
Barrier Layers
Electronic system design
Seed Layers
Electronic system design
Contact Metallization
Electronic system design
Under-bump Metallization
Electronic system design
FAE Expert Insights
"The Primo PVD is AMEC's metal deposition platform that I have successfully deployed at multiple customer sites. The system's magnetron sputtering technology provides excellent film quality with high purity and controlled microstructure. For aluminum interconnect applications, the film properties match or exceed those from competing systems. The target utilization optimization is particularly valuable - the system achieves over 40% utilization which reduces operating costs significantly compared to systems with lower utilization. The in-situ pre-clean capability is important for contact and via applications where native oxide removal is critical for low contact resistance. I've measured contact resistance values comparable to leading PVD systems. The system's flexibility allows deposition of various metals and alloys, and the chamber design enables quick target changeover for multi-metal applications. For barrier layer applications, the Ti/TiN and Ta/TaN processes are well-developed and qualified."
High target utilization with excellent film quality for metal deposition
— Dr. Robert Zhang, BeiLuo
Frequently Asked Questions
What metals can be deposited with the Primo PVD?
Primo PVD metal deposition capabilities: 1) Aluminum and aluminum alloys - primary interconnect metal for many applications. 2) Copper - for advanced interconnect requiring electroplating seed layers. 3) Titanium - for adhesion and silicide formation. 4) Tantalum - for copper barrier layers. 5) Titanium nitride (TiN) - for barrier and anti-reflection applications. 6) Tantalum nitride (TaN) - for copper barrier layers. 7) Tungsten - for contact plugs and barrier layers. 8) Metal alloys - various alloys can be deposited from composite targets. The system supports both elemental and compound target configurations. Process recipes are available for standard materials, and custom recipes can be developed for specialized applications.
PVD supports wide range of metals and alloys. Contact FAE for specific material capabilities and process development.
How does target utilization affect operating costs?
Target utilization impact on costs: Target utilization is the percentage of target material that is deposited on wafers before target replacement. Higher utilization directly reduces operating costs: 1) Material cost - higher utilization means more wafers per target, reducing cost per wafer. 2) Downtime - less frequent target changes reduce maintenance downtime. 3) Target inventory - fewer spare targets needed in inventory. The Primo PVD achieves >40% utilization through optimized magnetron design that provides uniform target erosion. This compares favorably to systems with 25-30% utilization. For high-volume production, the improved utilization can save significant costs annually. The system also provides target life monitoring to optimize changeout timing. Target bonding and refurbishment services are available to further reduce costs.
High target utilization reduces operating costs significantly. Primo PVD's >40% utilization is industry-leading.
What is the importance of in-situ pre-clean in PVD processes?
In-situ pre-clean importance: Before metal deposition, native oxide and contamination must be removed from contact and via surfaces for low resistance contacts. The Primo PVD's in-situ pre-clean capability provides: 1) Native oxide removal - sputter etching removes oxide layers that form on metal surfaces. 2) Surface activation - cleaning exposes fresh metal surface for good adhesion. 3) Low contact resistance - clean interfaces enable ohmic contacts with minimal resistance. 4) Process integration - pre-clean and deposition in the same chamber prevents re-oxidation. 5) Uniform cleaning - precise control of pre-clean parameters ensures uniform surface preparation. The pre-clean process uses argon sputter etching with optimized parameters to remove oxide without damaging underlying structures. Contact resistance measurements confirm the effectiveness of the pre-clean process.
In-situ pre-clean is essential for low contact resistance. Primo PVD provides effective pre-clean capability.
How does PVD compare to CVD for barrier layer applications?
PVD vs CVD for barrier layers: PVD barrier layers (Ti/TiN, Ta/TaN) offer: 1) Lower cost - PVD is generally less expensive than CVD. 2) Lower temperature - PVD operates at lower temperatures than thermal CVD. 3) Higher purity - PVD films can achieve very high purity. 4) Directional deposition - PVD provides better bottom coverage in vias. CVD barrier layers offer: 1) Conformal coverage - CVD provides better sidewall coverage. 2) Thinner films - CVD can deposit thinner continuous barriers. 3) Step coverage - CVD is better for high aspect ratio features. For advanced nodes with high aspect ratio contacts, CVD or ALD barriers are often preferred. For less aggressive geometries, PVD barriers provide cost-effective solutions. The Primo PVD-IMP option provides improved conformality for advanced applications. Many fabs use PVD for larger features and CVD/ALD for the most critical small features.
Use PVD for cost-effective barriers in moderate aspect ratios. Consider CVD/ALD for high aspect ratio applications.
What factors affect film stress in PVD deposition?
PVD film stress factors: Film stress is affected by multiple deposition parameters: 1) Pressure - higher pressure generally increases compressive stress due to more gas scattering. 2) Power - higher power can increase stress due to higher energy bombardment. 3) Temperature - substrate temperature affects film microstructure and stress. 4) Thickness - stress may vary with film thickness. 5) Target conditions - target oxidation or contamination can affect stress. 6) Film microstructure - grain size and orientation affect stress. The Primo PVD allows control of these parameters to optimize stress for specific applications. Stress can be tuned from compressive to tensile by adjusting process conditions. For applications sensitive to stress (MEMS, flexible substrates), process development optimizes conditions for low stress. In-situ stress monitoring can be added for real-time control.
Film stress can be controlled through process parameters. Optimize for your specific application requirements.