YMTC Products

YMTC offers four main product categories: (1) TLC 3D NAND Flash - Triple-Level Cell NAND with high storage density and balanced performance for mainstream applications; (2) QLC 3D NAND Flash - Quad-Level Cell NAND offering highest density for read-intensive workloads; (3) Enterprise SSD Solutions - high-performance solid-state drives for data center and enterprise storage; (4) Embedded Storage Solutions - eMMC and UFS products for mobile and IoT applications. Each category leverages YMTC's Xtacking architecture for superior performance and reliability.

Review each product category to find the YMTC NAND solution matching your storage requirements.

Selecting the right YMTC NAND depends on your application requirements: (1) For enterprise storage - choose high-capacity TLC NAND with high endurance for mixed workloads; (2) For consumer SSDs - select cost-effective TLC NAND for mainstream performance; (3) For read-intensive applications - consider QLC NAND for maximum capacity at lower cost; (4) For mobile devices - choose low-power eMMC or UFS solutions. Key parameters include capacity, endurance (P/E cycles), performance (read/write speed), power consumption, and temperature range. Contact LiTong FAE for detailed selection guidance.

Match the NAND type to your workload characteristics: TLC for mixed workloads, QLC for read-intensive applications.

YMTC Xtacking technology features: (1) Wafer bonding - peripheral circuits and memory arrays fabricated separately then bonded; (2) Higher I/O speed - enables faster data transfer than conventional architectures; (3) Better density - achieves industry-leading storage density with more layers; (4) Shorter development cycle - faster technology iteration and time-to-market; (5) Lower power consumption - optimized design reduces energy usage; (6) Superior yield - independent optimization of peripheral and array processes. Xtacking has evolved through Xtacking 1.0 (64-layer) to Xtacking 4.0 (232-layer), each generation delivering significant improvements in density, performance, and power efficiency.

YMTC Xtacking delivers superior performance, density, and power efficiency compared to conventional 3D NAND architectures.

YMTC products offer competitive advantages: (1) Technology - Xtacking architecture enables comparable or superior density and performance; (2) Cost - domestic Chinese production offers attractive pricing; (3) Innovation - rapid advancement from 32-layer to 232-layer in few years; (4) Local support - strong technical support in China with fast response; (5) Supply security - indigenous technology reduces geopolitical risks. YMTC's X4-9070 (232-layer TLC) competes with industry leaders in density and performance. While established suppliers have broader ecosystems, YMTC offers excellent value for cost-sensitive applications and is gaining market share in enterprise and consumer segments.

YMTC offers excellent price-performance ratio with innovative technology and strong local support.

YMTC maintains high quality and reliability standards: (1) Manufacturing - state-of-the-art fab in Wuhan with advanced process technology; (2) Testing - comprehensive wafer sort, final test, and reliability screening; (3) Certifications - ISO 9001, ISO 14001, and AEC-Q100 for automotive; (4) Endurance - TLC products offer 3,000-5,000 P/E cycles, QLC offers 1,000+ P/E cycles; (5) Data retention - 10 years at 40°C for enterprise products; (6) Field proven - deployed in millions of devices across enterprise, consumer, and automotive markets. YMTC's quality management system ensures products meet stringent requirements for various applications.

YMTC products meet industry-standard quality and reliability requirements for diverse storage applications.