Vicor ChiP Power Modules | BeiLuo Distributor

About ChiP Power Modules

Vicor's ChiP modules offer the highest power density in compact surface-mount packages for space-constrained applications.

As an authorized distributor of Vicor, BeiLuo provides a comprehensive range of ChiP Power Modules products. These products are widely used in industrial control, automotive electronics, consumer electronics, and communication equipment. We offer a complete product line with multiple series to meet various application requirements. All products are genuine and original, backed by professional technical support and comprehensive after-sales service.

Selection Guide: How to Choose the Right ChiP Power Modules

Product List

1 products available

Part Number ↕	Input Voltage ↕	Output Voltage ↕	Output Power ↕	Efficiency ↕	Current ↕	Package ↕	Stock Status	Action
BCM48BF480T1K3A00	38-55V DC (48V nominal)	48V (K=1/1 ratio)	1.3kW	Up to 97%	27A output at 48V	SM-ChiP 23mm height	In Stock	View Details

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Frequently Asked Questions

What are the advantages of ChiP modules?

ChiP module advantages: Highest power density - up to 1,000W per cubic inch

Integrated thermal pad - direct heatsink attachment without hardware

Surface mount assembly - compatible with standard SMT manufacturing

Flexible thermal options - air, forced air, or liquid cooling

High efficiency - up to 98% peak efficiency

Robust construction - proven reliability in demanding environments.

Contact our FAE team for ChiP module recommendations for your application.

How do I select between SM-ChiP and DChiP packages?

Package selection criteria: SM-ChiP: Surface mount for automated assembly

Lower profile options (9mm-23mm)

Best for high-volume production

Ideal for thin systems. DChiP: Through-hole for higher power

Better thermal performance

Easier manual assembly

Higher current ratings. Choose based on: Assembly method (SMT vs through-hole)

Power level required

Form factor constraints

Volume requirements.

What thermal interface is required for ChiP modules?

ChiP thermal interface requirements: Integrated thermal pad on bottom of module

Thermal interface material (TIM) required between pad and heatsink

Options: Thermal grease, thermal pads, phase change materials. Selection criteria: Power dissipation level

Thermal resistance requirements

Assembly method

Reliability requirements. Vicor provides thermal models and TIM recommendations for each module.

Can ChiP modules be used in high-reliability applications?

High-reliability ChiP applications: Vicor offers Hi-Rel and defense-grade ChiP modules

MIL-PRF-38534 compliant versions available

Extended temperature ranges

Enhanced screening and testing. Standard vs Hi-Rel: Standard modules for commercial/industrial use

Hi-Rel modules for aerospace, defense, medical

Custom screening available for specific requirements. Contact Vicor for high-reliability options.

How do I assembly ChiP modules on PCBs?

ChiP module assembly process: Standard SMT reflow process compatible

Follow Vicor assembly guidelines

Key steps: Apply solder paste to PCB pads

Place module using pick-and-place

Reflow solder following profile

Inspect for alignment and solder joints. Important considerations: Flatness of PCB substrate

Solder paste coverage under thermal pad

Reflow profile compatibility

No-wash requirement if thermal pad is grounded. Vicor provides detailed assembly instructions and reflow profiles.