Vanchip RF Power Amplifiers | BeiLuo Distributor

About RF Power Amplifiers

Vanchip RF power amplifiers deliver industry-leading efficiency and linearity for 4G/5G mobile and IoT applications. The portfolio includes discrete PAs for custom designs and integrated modules for rapid deployment, covering all major cellular bands from 600MHz to 6GHz.

As an authorized distributor of Vanchip, BeiLuo provides a comprehensive range of RF Power Amplifiers products. These products are widely used in industrial control, automotive electronics, consumer electronics, and communication equipment. We offer a complete product line with multiple series to meet various application requirements. All products are genuine and original, backed by professional technical support and comprehensive after-sales service.

Selection Guide: How to Choose the Right RF Power Amplifiers

Product List

2 products available

Part Number ↕	Frequency Range ↕	Output Power ↕	PAE ↕	Gain ↕	EVM ↕	Package ↕	Stock Status	Action
VC5778	3.3 - 4.2 GHz	26 dBm	42%	26 dB	< 2.5%	CSP 2.0×2.0 mm	In Stock	View Details
VC5134	-	28.5 dBm	45%	28 dB	< 3%	CSP 3.0×3.0 mm	In Stock	View Details

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Frequently Asked Questions

What frequency bands do Vanchip PAs cover?

Vanchip PAs cover all major cellular frequency bands from 600MHz to 6GHz, including: (1) Low-band: B5, B8, B12, B13, B20, B28 (600-900MHz)

(2) Mid-band: B1, B2, B3, B4, B7, B30, B34, B39 (1.7-2.7GHz)

(3) High-band: B40, B41, B42, B48 (2.3-3.8GHz)

(4) 5G NR: n77, n78, n79 (3.3-5.0GHz). Wideband PAs support multiple bands with a single device, reducing BOM complexity for global handset designs.

Identify your target markets and required bands, then select single-band or multi-band PAs accordingly.

How do I interpret Vanchip PA efficiency specifications?

Vanchip PA efficiency is specified as Power-Added Efficiency (PAE), calculated as (RF Output Power - RF Input Power) / DC Input Power × 100%. Typical values range from 35-50% depending on band and power level. Higher PAE means less heat generation and longer battery life. Key efficiency specifications include: (1) Peak PAE - maximum efficiency at rated power

(2) Average PAE - efficiency at typical operating power

(3) Back-off efficiency - efficiency at lower power levels. For 5G applications with high peak-to-average ratio, average PAE is more critical than peak PAE.

Compare PAE specifications at your target operating power level, not just peak ratings.

What is the typical gain of Vanchip power amplifiers?

Vanchip power amplifiers offer high gain to minimize driver stage requirements: (1) Low-band PAs: 28-32dB gain

(2) Mid-band PAs: 26-30dB gain

(3) High-band/5G PAs: 24-28dB gain. Higher gain reduces the output power requirement from the transceiver, improving overall system efficiency. The gain is specified as small-signal gain at room temperature. Temperature coefficient is typically -0.01dB/°C, ensuring stable performance across the operating temperature range of -40°C to +85°C.

Ensure PA gain provides adequate margin above your minimum required gain, considering temperature and process variations.

How do Vanchip PAs perform for 5G NR applications?

Vanchip 5G NR PAs are specifically optimized for 5G requirements: (1) High linearity - EVM < 3% and ACLR < -38dBc for 100MHz 5G NR signals

(2) Wide bandwidth - support up to 100MHz component carriers

(3) Carrier aggregation - support for up to 5 CA combinations

(4) Low latency - fast settling time for TDD operation

(5) Power Class 2 support - 26dBm output power for HPUE. These PAs meet 3GPP Release 15/16 specifications and are qualified by major OEMs for 5G smartphone applications.

For 5G designs, request 5G-specific datasheets and reference designs from our FAE team.

What packages are available for Vanchip PAs?

Vanchip PAs are available in various packages to meet different design requirements: (1) CSP (Chip Scale Package) - smallest footprint (1.5×1.5mm to 3×3mm) for space-constrained smartphones

(2) QFN (Quad Flat No-lead) - robust package with good thermal performance (3×3mm to 5×5mm)

(3) WLCSP (Wafer-Level CSP) - thinnest profile for ultra-slim designs

(4) Module packages - integrated FEMs with multiple dies in a single package. All packages are RoHS compliant and support standard SMT assembly processes.

Select package based on PCB space, height constraints, and thermal requirements.