H27QCG8D2M5R
SK Hynix 3D TLC NAND Flash 512Gb high-density storage solution with Toggle DDR interface
Product Overview
Description
The H27QCG8D2M5R is a high-density 3D TLC NAND Flash device offering 512Gb (64GB) storage capacity. This advanced NAND utilizes SK Hynix's 3D stacking technology with over 100 layers, delivering high density and excellent reliability. The Toggle DDR interface supports fast data transfer rates up to 800MT/s.
Designed for SSDs and embedded storage applications, this TLC NAND provides an optimal balance of performance, endurance, and cost. The device supports 1,000-3,000 P/E cycles, making it suitable for consumer and enterprise SSDs. Advanced error correction and bad block management features ensure data integrity.
The BGA-152 package enables compact designs while maintaining excellent thermal performance. This NAND is ideal for SATA and NVMe SSDs, mobile storage, and industrial applications requiring high-capacity, reliable storage.
Product Series
H
Primary Application
Consumer SSDs
Key Features
- 512Gb high-density 3D TLC NAND
- Toggle DDR 4.0 high-speed interface
- Over 100 layers 3D stacking technology
- 1,000-3,000 P/E cycle endurance
- Advanced error correction support
- BGA-152 compact package
Specifications
| Memory Type | 3D TLC NAND |
|---|---|
| Density | 512Gb (64GB) |
| Interface | Toggle DDR 4.0 |
| Data Rate | Up to 800MT/s |
| Voltage | 1.8V / 3.3V |
| Package | BGA-152 |
| Page Size | 16KB |
| Block Size | 4MB |
| Operating Temperature | 0C to +70C |
Applications
Consumer SSDs
Consumer electronics
Enterprise SATA SSDs
Electronic system design
Mobile storage
Electronic system design
Embedded systems
Electronic system design
Industrial storage
Industrial automation and control
Network equipment
Communication and interface
FAE Expert Insights
"The H27QCG8D2M5R is an excellent TLC NAND choice for mainstream SSD applications. This 512Gb device provides the right balance of density, performance, and cost. The Toggle DDR interface delivers consistent high-speed performance for both sequential and random workloads. I particularly appreciate the reliability characteristics - the 3D architecture provides better data retention than older planar NAND. For SSD designers, this NAND works well with popular controllers and supports advanced features like LDPC error correction. The BGA-152 package is easy to work with for both prototyping and production. I've seen this NAND used successfully in consumer SSDs, industrial storage, and even some entry-level enterprise applications."
High-density TLC NAND with excellent balance of performance and reliability
— David Kim, BeiLuo
Frequently Asked Questions
What is the typical endurance of this TLC NAND?
The H27QCG8D2M5R TLC NAND provides endurance of 1,000-3,000 P/E (Program/Erase) cycles: 1) Consumer grade - typically 1,000 P/E cycles, suitable for client SSDs with moderate write workloads, 2) Industrial grade - up to 3,000 P/E cycles for more demanding applications, 3) Endurance varies with operating conditions - lower temperatures and optimal voltage extend life, 4) Write amplification - actual endurance depends on write amplification factor in the SSD controller, 5) Over-provisioning - additional spare blocks extend effective endurance.
Calculate TBW requirements based on write workload. Contact FAE for endurance analysis and over-provisioning recommendations.
What SSD controllers work with this NAND?
The H27QCG8D2M5R NAND is compatible with popular SSD controllers: 1) Phison controllers - E12, E13T, S12T series, 2) SMI controllers - SM2262EN, SM2263XT, 3) Marvell controllers - 88SS1074, 88SS1084, 4) InnoGrit controllers - IG5236, IG5666. The Toggle DDR 4.0 interface is widely supported. When selecting a controller, consider: target performance (sequential read/write speeds), interface (SATA vs NVMe), LDPC ECC strength, and DRAM vs DRAMless implementation. Our FAE team can provide controller compatibility recommendations for your specific application requirements.
Select controllers based on target performance and interface requirements. Contact FAE for controller compatibility guidance.
What is the page and block size of this NAND?
The H27QCG8D2M5R features: 1) Page size - 16KB per page for efficient data transfer, 2) Block size - 4MB per block containing multiple pages, 3) Page structure - each page includes data area and spare area for ECC, 4) Block architecture - blocks are the minimum erase unit in NAND Flash, 5) Performance - large page size enables high sequential throughput. Understanding page and block structure is essential for optimizing SSD firmware and maximizing performance.
Design firmware to optimize for 16KB page size. Plan erase operations at 4MB block granularity.
What is the data retention specification?
Data retention specifications for H27QCG8D2M5R: 1) Standard retention - 10 years for fresh data (low P/E cycles), 2) End-of-life retention - 1 year at maximum rated P/E cycles, 3) Temperature dependence - retention decreases at higher temperatures, 4) Read disturb - excessive reads can affect adjacent cells, 5) Storage conditions - store unprogrammed devices in controlled environment. Data retention is critical for archival applications. Implement periodic refresh for long-term storage applications.
Plan for data refresh in long-term storage. Monitor retention characteristics as NAND ages.
What package options are available?
The H27QCG8D2M5R is available in BGA-152 package: 1) Package type - BGA (Ball Grid Array) with 152 balls, 2) Dimensions - compact footprint suitable for space-constrained designs, 3) Ball pitch - standard pitch for automated assembly, 4) Thermal characteristics - designed for proper heat dissipation, 5) PCB requirements - follow SK Hynix layout guidelines for optimal signal integrity. BGA packages require proper PCB design and assembly processes. Contact FAE for package drawings and layout recommendations.
Use BGA-152 for standard SSD designs. Follow SK Hynix PCB layout guidelines.