OSiC20M650
650V SiC MOSFET optimized for high-frequency DC-DC converters and PFC applications.
Product Overview
Description
The OSiC20M650 is a 650V SiC MOSFET designed for high-efficiency, high-frequency power conversion applications.
With RDS(on) of 45m ohm and ultra-fast switching, this device enables compact, high-density power supply designs.
The 650V rating is ideal for 380-480V AC input applications including server power supplies and telecom rectifiers.
Product Series
OSiC
Primary Application
Server power supplies
Key Features
- Ultra-low RDS(on) of 45m ohm
- Fast switching for high frequency
- 175°C maximum junction temperature
- Zero reverse recovery
- Low switching losses
- Compatible with standard gate drivers
Specifications
| Voltage Rating | 650V |
|---|---|
| Current Rating | 20A |
| RDS(on) | 45m ohm (typ) |
| Package | TO-247-3 |
| Temperature | 175°C (max) |
Applications
Server power supplies
Electronic system design
Telecom rectifiers
Electronic system design
PFC circuits
Electronic system design
DC-DC converters
Power conversion and supply
FAE Expert Insights
"The OSiC20M650 is an excellent choice for high-density server and telecom power supplies. The 650V rating is perfect for universal input (90-264V AC) and high-voltage DC (380V) applications. In my experience with 1kW server PSU designs, using this SiC MOSFET for the PFC stage achieves efficiency above 99% at 50% load, compared to 97-98% with silicon super-junction MOSFETs. The ability to switch at 100kHz+ allows dramatic reduction in boost inductor size. The TO-247-3 package is compatible with standard mounting and heatsink solutions. For designs where efficiency and power density are critical, this device provides excellent value."
High-efficiency solution for server and telecom power supplies
— Steven Wu, BeiLuo
Frequently Asked Questions
When does the cost premium of SiC MOSFETs become justified?
The cost premium of SiC MOSFETs (3-5x vs silicon) becomes justified when: First, efficiency improvements translate to significant operating cost savings - in high-power continuous operation (e.g., data centers, EV chargers), 2-3% efficiency gain can save thousands in electricity costs annually. Second, reduced cooling requirements enable smaller heatsinks, fans, or elimination of liquid cooling, reducing system cost. Third, higher frequency operation allows smaller magnetics and capacitors, reducing overall system size and cost. Fourth, higher power density enables smaller enclosures or more power in the same space. Generally, SiC becomes cost-effective for systems above 5kW or where size/weight constraints are critical.
Evaluate total system cost including cooling and magnetics; SiC often pays back in high-power or high-density applications.
What is the recommended soldering profile for OSiC20M650?
Standard reflow soldering profile per JEDEC J-STD-020 is recommended. Peak temperature should not exceed 260°C for Pb-free solder. Preheat at 150-180°C for 60-90 seconds. Soak at 217°C for 60-90 seconds. Peak at 245-260°C for 20-40 seconds. Allow adequate cooling time. Hand soldering is possible with temperature-controlled irons at 350°C maximum, limited to 3-5 seconds per lead. Avoid thermal shock by not exceeding 4°C/second heating/cooling rates.
Use standard Pb-free reflow profile. Contact us for specific soldering recommendations.
What is the MTBF of OSiC20M650?
The OSiC20M650 has an MTBF (Mean Time Between Failures) of >100 million hours at 25°C operating temperature, calculated per Telcordia SR-332. This corresponds to a FIT rate of <10 failures per billion device-hours. Reliability is verified through accelerated life testing at elevated temperatures. The high MTBF makes this component suitable for mission-critical applications.
Suitable for high-reliability applications. Contact us for detailed reliability reports.
What is the ESD sensitivity rating of OSiC20M650?
This component has an ESD HBM (Human Body Model) rating of 2kV and CDM (Charged Device Model) rating of 500V. While this provides reasonable protection, standard ESD precautions should always be followed during handling and assembly. Use grounded workstations, ESD-safe tools, and proper personnel grounding.
Use standard ESD precautions. Contact us for high-ESD environment recommendations.
What is the lead time for OSiC20M650?
Standard lead time for Oriental products is 4-6 weeks for production quantities. Samples are typically available from stock with 1-2 week lead time. For high-volume orders or custom requirements, contact our sales team to discuss scheduling and potential buffer stock arrangements.
Contact our sales team for current lead times and availability.