CXMT (ChangXin Memory Technologies) Products

CXMT offers four main DRAM product categories: (1) DDR5 Memory - high-performance DRAM with speeds up to 8000Mbps, available in 16Gb and 24Gb densities, supporting UDIMM, SODIMM, RDIMM, MRDIMM, CUDIMM, and CSODIMM form factors for data centers, servers, and PCs; (2) LPDDR5X Memory - ultra-low power mobile DRAM with speeds up to 10667Mbps, available in 12Gb and 16Gb densities for flagship smartphones and mobile devices; (3) DDR4 Memory - mainstream DRAM solutions for enterprise and consumer applications; (4) LPDDR4/LPDDR4X Memory - power-efficient mobile DRAM for smartphones, tablets, and IoT devices. All products are manufactured in CXMT's advanced 12-inch wafer fabs.

Review each product category to find the CXMT memory solution matching your application requirements, performance needs, and platform compatibility.

Selecting CXMT DDR5 for server applications requires considering: (1) Module type - RDIMM for standard servers, MRDIMM for high-performance servers, UDIMM for workstations; (2) Capacity - 16Gb or 24Gb dies, with modules ranging from 16GB to 96GB; (3) Speed grade - 4800Mbps, 5600Mbps, 6400Mbps, 7200Mbps, or 8000Mbps based on platform support; (4) Platform compatibility - verify with Intel Xeon or AMD EPYC processor specifications; (5) Form factor - standard height or TFF (Tall Form Factor) for high-capacity modules; (6) Temperature - standard (0°C to 85°C) or extended temperature range; (7) ECC support - required for server applications. CXMT DDR5 is fully JEDEC compliant and compatible with major server platforms.

Use our DDR5 selection guide or contact technical team with your server platform specifications for recommendations.

CXMT DDR5 vs DDR4 comparison: (1) Speed - DDR5 starts at 4800Mbps vs DDR4 at 3200Mbps, with DDR5 reaching 8000Mbps; (2) Voltage - DDR5 operates at 1.1V vs DDR4 at 1.2V, providing better power efficiency; (3) Density - DDR5 offers 16Gb and 24Gb dies vs DDR4 maximum 16Gb; (4) Architecture - DDR5 has dual 32-bit channels per DIMM vs DDR4 single 64-bit channel; (5) On-Die ECC - DDR5 includes ECC on the chip for improved reliability; (6) PMIC - DDR5 modules include on-board power management IC; (7) Compatibility - DDR5 requires new platforms (Intel 12th gen+, AMD AM5), not backward compatible with DDR4. CXMT offers both DDR5 for new designs and DDR4 for legacy systems.

Choose DDR5 for new high-performance designs. Use DDR4 for legacy platform compatibility. CXMT offers both options.

For smartphone LPDDR5X selection: (1) Density - 12Gb or 16Gb dies based on capacity requirements; (2) Speed grade - 8533Mbps for mainstream flagships, 9600Mbps for premium devices, 10667Mbps for ultra-premium; (3) Package type - standalone die for PoP (Package on Package) with SoC, or MCP (Multi-Chip Package) for integrated solutions; (4) Capacity configuration - 8GB, 12GB, 16GB, or 24GB based on device tier; (5) Power efficiency - all LPDDR5X speeds offer improved power consumption vs LPDDR5; (6) SoC compatibility - verify with mobile processor vendor (Qualcomm, MediaTek, Samsung); (7) Thermal characteristics - ensure meets smartphone thermal constraints. CXMT LPDDR5X is used in flagship smartphones from major brands.

Contact our mobile memory specialists with your SoC platform and capacity requirements for LPDDR5X recommendations.

CXMT supports comprehensive memory form factors: (1) DDR5 Modules - UDIMM (Unbuffered DIMM) for desktops, SODIMM (Small Outline DIMM) for laptops, RDIMM (Registered DIMM) for servers, MRDIMM (Multiplexed Rank DIMM) for high-performance servers; (2) Advanced DDR5 - CUDIMM/CSODIMM (Clocked Unbuffered DIMM) with integrated clock drivers for enhanced performance; (3) LPDDR Packages - standalone dies for PoP, MCP (Multi-Chip Package), and LPCAMM2 modules; (4) Custom Solutions - CXMT can provide custom packaging for specific customer requirements. All form factors are JEDEC compliant and compatible with standard memory slots and interfaces.

Select form factor based on your system design. Contact technical team for custom packaging requirements.