AutoChips Automotive MCUs

AutoChips automotive MCUs utilize ARM Cortex-M series processors optimized for automotive applications. The AC7801x series features Cortex-M0+ cores for cost-sensitive body control applications. The AC781x series uses Cortex-M3 cores for mid-range applications requiring higher performance. The AC7840x series incorporates Cortex-M4F cores with DSP and FPU for advanced motor control and signal processing applications. All cores are automotive-qualified and include memory protection units (MPU) for safety-critical applications.

Select Cortex-M0+ for simple control tasks, M3 for general automotive applications, M4F for motor control and DSP.

AutoChips automotive MCUs support functional safety levels from QM (Quality Managed) up to ASIL-D (Automotive Safety Integrity Level D). The MCUs include hardware safety features such as dual-core lockstep, ECC (Error Correction Code) on memory, clock monitoring, and voltage monitoring. Software support includes safety libraries and documentation for ISO 26262 compliance. ASIL-B support is available for body control and comfort systems, while ASIL-D support targets safety-critical applications like braking and steering systems.

Select ASIL-B for body control, ASIL-D for safety-critical systems. Contact LiTong for safety documentation.

AutoChips automotive MCUs provide comprehensive communication interfaces for modern vehicle networks. Standard interfaces include CAN-FD (Controller Area Network with Flexible Data-rate) for high-speed vehicle communication, LIN (Local Interconnect Network) for low-cost body electronics, SPI and I2C for peripheral communication, and UART for debugging and external devices. Advanced MCUs also include Ethernet for ADAS applications and FlexRay for high-speed deterministic communication. Multiple instances of each interface allow connection to various vehicle subsystems.

Select MCUs with CAN-FD for modern vehicle networks, LIN for door/seat modules, Ethernet for ADAS applications.

AutoChips automotive MCUs offer a range of memory configurations to suit different application requirements. Flash memory options range from 64KB for simple applications to 512KB for complex control systems. RAM ranges from 8KB to 128KB for data storage and stack operations. All memory includes ECC support for safety-critical applications. Some devices include dual-bank Flash for firmware updates without system downtime. The memory architecture supports efficient code execution and real-time data processing for automotive control applications.

Select memory size based on application complexity. Allow 20-30% margin for future firmware updates.

AutoChips automotive MCUs are available in various packages to meet different application requirements. Standard packages include LQFP (Low-profile Quad Flat Package) from 32-pin to 144-pin for general applications. QFN (Quad Flat No-lead) packages offer smaller footprint for space-constrained designs. BGA (Ball Grid Array) packages provide highest pin density for complex systems. All packages are AEC-Q100 qualified and support extended temperature ranges. Package selection depends on I/O requirements, thermal considerations, and manufacturing capabilities.

Select LQFP for prototyping, QFN for compact designs, BGA for high pin count requirements.