XCZU19EG-2FFVC1760E
High-capacity Zynq UltraScale+ MPSoC with quad-core Cortex-A53, dual-core Cortex-R5, 1.96M logic cells.
Product Overview
Description
The XCZU19EG-2FFVC1760E is the highest-capacity Zynq UltraScale+ MPSoC, featuring 1,968,000 system logic cells and 7,560 DSP slices. The processing system includes quad-core ARM Cortex-A53 and dual-core Cortex-R5 for heterogeneous computing.
This device provides 76 GTH transceivers supporting up to 16.3 Gbps for high-speed connectivity, enabling 100G Ethernet, PCIe Gen4, and multi-lane SerDes applications. The FFVC1760 package offers 848 user I/O pins.
Designed for high-performance embedded computing, this MPSoC targets 5G baseband processing, radar signal processing, test and measurement equipment, and high-end industrial controllers requiring massive parallel processing capabilities.
Product Series
XCZU
Primary Application
5G Baseband
Key Features
- High efficiency and reliability
- Optimized for industrial applications
- Comprehensive technical support
- Available from stock
Specifications
| Application Processor | Quad-core Cortex-A53 (1.5 GHz) |
|---|---|
| Real-time Processor | Dual-core Cortex-R5 (600 MHz) |
| Logic Cells | 1,968,000 |
| DSP Slices | 7,560 |
| GTH Transceivers | 76 (16.3 Gbps) |
| I/O Pins | 848 |
| Package | FFVC1760 (42.5x42.5mm) |
Applications
5G Baseband
Electronic system design
Radar Processing
Electronic system design
Test & Measurement
Data acquisition and conversion
High-End Industrial
Industrial automation and control
FAE Expert Insights
"The XCZU19EG is the pinnacle of Zynq MPSoC technology with nearly 2 million logic cells. This device is designed for the most demanding embedded applications where both massive FPGA resources and powerful processors are required. I've deployed this in 5G baseband applications where the 7,560 DSP slices handle massive MIMO processing while the A53 cores manage the protocol stack. The 76 GTH transceivers provide incredible connectivity - enough for multiple 100G Ethernet links or PCIe Gen4 x16. Power consumption is significant at 20-30W, but the performance per watt is excellent for this class of device. The sheer scale of this device requires careful power and thermal design. This is not for typical embedded applications - it's for high-end signal processing, communications infrastructure, and advanced industrial systems that need supercomputer-class performance in an embedded form factor."
Maximum performance MPSoC for high-end signal processing and communications
— Robert Zhang, BeiLuo
Frequently Asked Questions
What is the maximum bandwidth this device can handle?
The XCZU19EG offers massive bandwidth: 1) Transceiver bandwidth - 76 x 16.3 Gbps = 1.24 Tbps raw, 2) DDR4 memory - up to 4 channels at 2,400 Mbps each, 3) PS-PL interface - multiple AXI ports totaling 100+ GB/s, 4) Internal bandwidth - abundant routing for high fanout designs, 5) External I/O - 848 pins for parallel interfaces. This bandwidth supports 100G+ networking, massive sensor arrays, and high-throughput signal processing.
Plan bandwidth requirements early. Use multiple memory channels for data-intensive applications.
How do I manage power for this large device?
Power management for XCZU19EG: 1) Core voltage - 0.85V with high current requirements, 2) Power sequencing - strict sequence required for reliable boot, 3) Thermal design - requires heatsink and airflow, 4) Power estimation - use XPE for accurate analysis, 5) Dynamic power - support for clock and power gating. Expect 20-30W typical, up to 50W worst case. Multi-phase regulators recommended for core supply.
Use multi-phase regulators for core. Plan thermal design for 50W worst case. Follow sequencing requirements.
What applications benefit most from this device?
Best applications for XCZU19EG: 1) 5G baseband - massive MIMO processing, 2) Radar - synthetic aperture and beamforming, 3) Test equipment - high-speed signal generation and analysis, 4) High-end industrial - motion control with many axes, 5) Aerospace - high-performance payload processing. The combination of massive FPGA resources and embedded processors is unique. Not cost-effective for simple embedded applications.
Use for applications requiring both massive FPGA resources and embedded processors.
How long does it take to compile designs for this device?
Compilation times for XCZU19EG: 1) Synthesis - 30-60 minutes for large designs, 2) Implementation - 1-3 hours depending on constraints, 3) Bitstream generation - 15-30 minutes, 4) Total - 2-5 hours for full compile, 5) Incremental - 30-60 minutes for small changes. Large designs require significant compute resources. Use high-performance workstation with 32GB+ RAM. Consider using incremental compile strategies.
Plan for long compile times. Use incremental compilation. Consider cloud-based compilation for occasional builds.
What debugging capabilities are available?
Debugging capabilities for XCZU19EG: 1) Processor debug - ARM DSF for A53 and R5 cores, 2) FPGA debug - ILA and VIO for signal capture, 3) Cross-trigger - between PS and PL for co-debug, 4) Trace - CoreSight trace for processor analysis, 5) Performance monitors - built-in PMU for profiling. Hardware Manager in Vivado provides unified debug environment. Plan debug architecture early - probe points consume resources.
Use cross-trigger for PS-PL co-debug. Plan debug architecture early in design cycle.