Electromagnetic interference (EMI) is a critical concern in switching power supply design. This guide covers proven techniques for minimizing both conducted and radiated emissions to meet regulatory requirements.

Understanding EMI Sources

Switching Transients: Fast switching edges (high dv/dt and di/dt) generate high-frequency harmonics that can radiate or conduct noise. The switching node is typically the primary noise source.

High-Current Loops: The area enclosed by high-current paths acts as an antenna for radiated emissions. Minimizing loop area is crucial for EMI control.

Common Mode Noise: Noise that appears equally on all lines relative to ground, often caused by parasitic capacitance between switching nodes and ground.

PCB Layout Strategies

Minimize Switching Loops: Keep the high-current switching loop (input capacitor, switch, inductor) as small as possible. This is the most important layout consideration.

Ground Plane Design: Use a solid ground plane under the power supply circuitry. Avoid splits or cuts in the ground plane that can force return currents to take longer paths.

Switching Node: Keep the switching node trace short and away from sensitive circuits. Do not route the switching node under the IC or near feedback traces.

Filtering Techniques

Input Filtering: Use a pi-filter or common mode choke at the input to reduce conducted emissions. Place ceramic capacitors close to the IC pins.

Output Filtering: Add small LC filters or ferrite beads on output rails if noise is coupling to sensitive circuits.

Snubber Circuits: RC snubbers across the switch or rectifier can reduce voltage overshoot and ringing, reducing high-frequency emissions.