HME-A5C300
High-end 300K LUT6 FPGA with 28Gbps transceivers, PCIe Gen3 x16, and HBM support for data center and HPC applications.
Product Overview
Description
The HME-A5C300 is a high-end FPGA featuring 300K LUT6 logic cells, designed for the most demanding data center and high-performance computing applications.
With 32 high-speed transceivers supporting up to 28Gbps, PCIe Gen3 x16 hard IP, and support for in-package HBM2 memory, this device delivers maximum bandwidth and performance.
Advanced features include 3D IC packaging options, dedicated AI acceleration engines, and comprehensive security features including hardware root of trust.
Product Series
HME
Primary Application
Data center acceleration
Key Features
- 300K LUT6 maximum capacity
- 28Gbps high-speed transceivers
- PCIe Gen3 x16 interface
- HBM2 memory support
- Dedicated AI acceleration engines
- Hardware security features
- 3D IC packaging options
Specifications
| Logic Capacity | 300K LUT6 |
|---|---|
| Block RAM | 18 Mbit |
| DSP Slices | 1200 18x25 MAC |
| Transceivers | 32 channels, 28Gbps |
| Hard IP | PCIe Gen3 x16, DDR4, HBM2 controller |
| AI Engines | 8 AI accelerator blocks |
| Packages | FCBGA1924, 3D IC |
Applications
Data center acceleration
Electronic system design
SmartNICs
Electronic system design
High-performance computing
Electronic system design
400G networking
Communication and interface
AI inference acceleration
Electronic system design
Computational storage
Electronic system design
FAE Expert Insights
"The HME-A5C300 is a flagship device that competes with the best FPGAs from international vendors. The 300K LUT capacity handles massive designs that would otherwise require multiple smaller FPGAs. I've worked with customers using this device for SmartNIC applications, achieving 400Gbps throughput with room to spare. The 28Gbps transceivers are rock-solid - we've validated them at full speed with excellent BER performance. The HBM2 support is a game-changer for bandwidth-intensive applications, providing terabytes-per-second memory bandwidth. One customer implemented a computational storage controller with this device, achieving 10x performance improvement over their previous solution. The AI engines provide significant acceleration for inference workloads - about 5x faster than generic FPGA fabric for matrix operations. Thermal management is critical - this device can dissipate 50-80W at full utilization, requiring liquid cooling or advanced air cooling. The FCBGA1924 package is large but manageable with proper PCB design. For signal integrity, I recommend following HME's layout guidelines carefully, especially for the high-speed transceivers."
Flagship high-end FPGA with HBM support for maximum performance applications
— Dr. Wang Wei, BeiLuo
Frequently Asked Questions
What thermal management is required for HME-A5C300?
Thermal management requirements: Power dissipation - 50-80W typical at full utilization. Cooling options: Air cooling - possible with large heatsink and forced airflow for moderate utilization. Liquid cooling - recommended for high-utilization designs. Cold plate with 1-2 L/min flow rate. Temperature monitoring - multiple on-die temperature sensors. Thermal design: Junction temperature must stay below 85°C for reliability. Use thermal interface material with low thermal resistance. Ensure uniform cooling across package. Consider ambient temperature and airflow in system design. For data center applications, liquid cooling is standard practice.
Plan for liquid cooling in high-performance applications. Contact us for thermal design support.
How does HBM2 integration work?
HBM2 integration: In-package - HBM2 dies are stacked and integrated in the same package as FPGA. Interface - wide parallel interface (1024-bit) provides massive bandwidth. Bandwidth - up to 460GB/s with HBM2. Capacity - 2GB to 8GB stacks available. Implementation: HBM controller is hardened in FPGA. Memory is visible as standard address space. No external PCB routing required. Considerations: HBM adds to device cost. Power consumption increases with HBM. Thermal design must account for HBM heat. Benefits: Massive bandwidth for data-intensive applications. Reduced PCB complexity. Lower latency than external memory.
Use HBM for bandwidth-intensive applications like AI and networking.