DSA25Q64A
AEC-Q100 Grade 1 qualified 64Mb SPI NOR Flash for automotive applications with -40°C to +125°C temperature range
Product Overview
Description
The DSA25Q64A is an AEC-Q100 Grade 1 qualified 64Mb SPI NOR Flash designed for automotive electronics. It meets stringent automotive reliability requirements and operates across -40°C to +125°C temperature range.
The device features enhanced reliability specifications, full PPAP documentation support, and lot traceability required for automotive production. It supports standard SPI flash commands for easy integration with automotive microcontrollers.
Ideal for automotive infotainment systems, instrument clusters, ADAS modules, and body electronics requiring reliable code storage in harsh automotive environments.
Product Series
DSA
Primary Application
Automotive infotainment
Key Features
- AEC-Q100 Grade 1 qualified
- Automotive temperature range
- 64Mb density for firmware
- 80MHz SPI interface
- Enhanced reliability
- PPAP documentation support
- Lot traceability
- WSON-8 package
Specifications
| Density | 64Mb (8MB) |
|---|---|
| Interface | SPI, 80MHz |
| Temperature Range | -40°C to +125°C |
| Qualification | AEC-Q100 Grade 1 |
| Endurance | 100,000 cycles |
| Data Retention | 20 years |
| Package | WSON-8 |
Applications
Automotive infotainment
Automotive and EV electronics
Instrument clusters
Electronic system design
ADAS modules
Automotive and EV electronics
Body electronics
Electronic system design
Telematics systems
Electronic system design
FAE Expert Insights
"The DSA25Q64A is a robust automotive-grade NOR flash that I've used in multiple Tier 1 automotive programs. The AEC-Q100 Grade 1 qualification is genuine and comprehensive - we've successfully completed PPAP for several OEMs without issues. The device performs reliably across the full temperature range, including under-hood applications. Key automotive considerations: Ensure proper decoupling and follow automotive PCB design guidelines. The WSON package has excellent thermal performance for automotive environments. We've passed EMC testing in multiple vehicle platforms with this device. The PPAP documentation package from LiTong is complete and well-organized. For functional safety applications (ASIL), additional analysis may be required. Overall, this is a reliable, well-qualified automotive memory solution."
AEC-Q100 Grade 1 qualified NOR flash for demanding automotive applications
— David Wang, BeiLuo
Frequently Asked Questions
What AEC-Q100 Grade 1 testing is performed?
AEC-Q100 Grade 1 testing for DSA25Q64A includes: (1) High Temperature Operating Life (HTOL) - 1000 hours at 125°C. (2) Temperature Cycling - 1000 cycles -40°C to +125°C. (3) High Temperature Storage - 1000 hours at 150°C. (4) Early Life Failure Rate (ELFR) - Statistical sampling for early failures. (5) ESD Testing - HBM 2kV, CDM 500V, MM 200V. (6) Latch-Up Testing - Current and voltage trigger tests. (7) Mechanical Stress - Vibration, mechanical shock, and solderability. (8) Moisture Sensitivity - MSL level determination. All testing performed per AEC-Q100 Rev-J standards. Test reports available as part of PPAP documentation.
Contact LiTong for AEC-Q100 test reports and qualification data.
What is the PPAP process for automotive?
PPAP (Production Part Approval Process) for DSA25Q64A: (1) Purpose - Validates that production process can consistently produce quality parts meeting specifications. (2) Levels - PPAP Level 3 typically required for new automotive parts (full documentation). (3) Documentation includes: Design Records, Engineering Change Documents, Customer Engineering Approval, Design FMEA, Process Flow Diagram, Process FMEA, Control Plan, Measurement System Analysis, Dimensional Results, Material/Test Results, Initial Process Studies, Qualified Laboratory Documentation, Appearance Approval Report, Sample Production Parts, Master Sample, Checking Aids, Customer Specific Requirements, Part Submission Warrant. (4) Timeline - Typically 8-12 weeks after production approval. (5) LiTong Support - Complete PPAP documentation package provided. Contact LiTong to initiate PPAP process.
Contact LiTong for PPAP documentation and submission support.
How does lot traceability work?
Lot traceability for DSA25Q64A automotive products: (1) Wafer Lot - Full traceability to wafer lot number, wafer ID, and die position. (2) Assembly Lot - Assembly date, location, and operator traceability. (3) Test Lot - Test equipment, program version, and test results linked to lot. (4) Marking - Each device marked with traceable lot code and date code. (5) Documentation - Certificate of Compliance with lot information provided with each shipment. (6) Storage - Traceability records maintained for minimum 10 years. (7) Recall Capability - Full traceability enables targeted recall if needed. This level of traceability is required for automotive quality systems and enables root cause analysis for any field issues.
Contact LiTong for lot traceability documentation and certificates.
What is the PCN process for automotive products?
PCN (Product Change Notification) process for DSA25Q64A: (1) Purpose - Notify customers of any changes to product or process. (2) Timeline - Minimum 12 months advance notice for major changes per AEC-Q100. (3) Change Types - Process changes, material changes, design changes, test changes, location changes. (4) Notification - Formal PCN document with change description, reason, timeline, and impact. (5) Customer Approval - Some changes require customer approval before implementation. (6) Last Time Buy - Offered for major changes with end-of-life implications. (7) Traceability - Clear separation of pre-change and post-change lots. DOSILICON follows JEDEC J-STD-046 PCN standards. LiTong manages PCN distribution to customers and coordinates any required actions.
Contact LiTong for PCN registration and change management.
Can DSA25Q64A be used for functional safety applications?
DSA25Q64A for functional safety applications: (1) AEC-Q100 - Provides foundation for automotive reliability but does not cover functional safety (ISO 26262). (2) Safety Analysis - Device safety analysis available for ASIL decomposition. (3) FIT Rate - Failure In Time rate data available for safety calculations. (4) Use Cases - Suitable for QM (Quality Management) and ASIL A/B applications with appropriate system-level measures. (5) Higher ASIL - For ASIL C/D, may need additional measures: redundant storage, ECC, CRC checking. (6) Safety Manual - Available with safety analysis and use assumptions. (7) System Responsibility - Functional safety achieved at system level, not component level. Contact LiTong for safety documentation and FIT rate data for safety analysis.
Contact LiTong for functional safety documentation and support.