BIPM600C20AS
600V 20A surface-mount IPM for compact motor drive applications. Features integrated gate drivers and protection.
Product Overview
Description
600V 20A surface-mount IPM for compact designs. SMD-36 package for automated assembly.
Integrated gate drivers and protection functions. Fault output signal for controller.
Ideal for high-volume production. In stock with FAE support.
Product Series
IPM Module
Primary Application
Key Features
- 600V 20A three-phase inverter
- Surface-mount SMD-36 package
- Built-in gate drivers
- Protection functions
- Fault output signal
- Compact design
Specifications
| Voltage | N/A |
|---|---|
| Current | N/A |
| Package | N/A |
Applications
Compact motor drives
Industrial application for IPM Intelligent Power Modules BIPM600C20AS
Home appliances
Industrial application for IPM Intelligent Power Modules BIPM600C20AS
Power tools
Industrial application for IPM Intelligent Power Modules BIPM600C20AS
Automotive auxiliary drives
Industrial application for IPM Intelligent Power Modules BIPM600C20AS
FAE Expert Insights
"BIPM600C20AS is perfect for high-volume home appliance applications. The SMD package enables automated assembly and compact designs. We've seen excellent results in washing machine and dishwasher applications."
SMD IPM for high-volume production
— Senior FAE - Consumer Electronics, BeiLuo
Frequently Asked Questions
What is the advantage of the SMD package?
The SMD-36 package offers several advantages: (1) Enables automated assembly for high-volume production. (2) Smaller footprint compared to DIP packages. (3) Better thermal performance with proper PCB design. (4) Reduced assembly cost. Ideal for high-volume applications like home appliances.
Use for high-volume production with automated assembly.
What is the thermal performance of SMD IPM?
The SMD package thermal performance depends on PCB design. Recommendations: (1) Use large copper areas for heat spreading. (2) Implement thermal vias to inner ground planes. (3) Consider forced air cooling for high power. (4) Thermal resistance can be optimized to <3K/W with good PCB design.
Optimize PCB design for thermal performance with large copper areas and thermal vias.