AW8737

The AW8737 is designed specifically for cost-sensitive applications while maintaining excellent audio performance. Key cost-saving features include: Simple application circuit requiring minimal external components - just input capacitors, supply decoupling, and output filtering. No external boost converter needed, reducing BOM cost and board space. Compact WCSP-16 package enables smaller PCB designs. Standard Class-D architecture without complex DSP features that add cost. High efficiency reduces battery and thermal management costs. Despite the cost optimization, the AW8737 delivers excellent audio quality with <0.1% THD+N and high PSRR. The device is pin-compatible with other Awinic amplifiers, allowing easy upgrades if more features are needed later. For high-volume applications, Awinic offers competitive pricing that makes the AW8737 an attractive alternative to more expensive premium solutions.

AW8737 offers excellent value for cost-sensitive applications. Contact our sales team for volume pricing.

The AW8737 incorporates several advanced EMI reduction technologies to minimize electromagnetic interference: Edge rate control slows the switching transitions of the output stage, reducing high-frequency harmonic content while maintaining efficiency. Spread spectrum modulation varies the switching frequency slightly around the nominal value, spreading the EMI energy across a wider frequency band and reducing peak emissions. Optimized output stage design minimizes ringing and overshoot that can cause radiated emissions. Differential output architecture reduces common-mode noise. These techniques work together to keep the AW8737's EMI emissions well below regulatory limits (CISPR 22/32 Class B) without requiring extensive external filtering. For most applications, simple ferrite beads on the output traces are sufficient to meet EMI requirements. The EMI performance is validated in Awinic's reference designs, and layout guidelines are provided to ensure customers achieve similar results.

AW8737 includes advanced EMI reduction. Follow layout guidelines for best results. Contact our FAE team for EMI support.

The AW8737 features ultra-low quiescent current of approximately 1.5mA when idle with no audio signal. This low quiescent current is important for battery-powered devices because it minimizes power consumption during silent periods or when playing quiet content. In typical smartphone use cases where audio is played intermittently, the quiescent current can significantly impact overall battery life. The AW8737 also features a shutdown mode with current consumption <1uA, allowing the system to completely power down the amplifier when not in use. The device can be quickly enabled via a GPIO control signal when audio playback is needed. For applications requiring always-on audio readiness, the low quiescent current ensures minimal battery drain. The efficiency remains high across the output power range, further optimizing battery life during active playback.

Low quiescent current extends battery life. Use shutdown mode for minimum power when not in use.

The AW8737 includes integrated pop and click suppression circuitry that eliminates audible transients during power-on, power-off, and mode transitions. This feature works by gradually ramping the output DC bias voltage and audio gain during startup, preventing the sudden voltage steps that cause speaker popping. The suppression is automatic and requires no external components or software control. For optimal performance: Ensure adequate supply decoupling with capacitors close to the device. Allow sufficient time for the internal bias circuits to stabilize before enabling playback. Use the shutdown mode rather than removing power for temporary mute functions. The pop and click suppression is validated across the operating temperature range and supply voltage range. If audible artifacts are still present in your application, check for ground bounce or supply voltage droop during switching, and ensure the speaker connections are secure.

Pop/click suppression is automatic. Ensure proper decoupling for best performance.

Yes, the AW8737 can drive speakers with impedances from 4 ohms to 16 ohms, though it is optimized for 4-ohm and 8-ohm speakers commonly used in portable devices. The output power capability varies with speaker impedance: 4-ohm speakers will deliver the maximum 2W output power. 8-ohm speakers will deliver approximately 1W output power. 16-ohm speakers will deliver approximately 0.5W output power. The amplifier automatically adjusts its operation to maintain stability and efficiency across the impedance range. When driving lower impedance speakers, ensure the power supply can deliver the required current. The protection circuits monitor output current and will limit drive if unsafe conditions are detected. For applications requiring stereo output, two AW8737 devices can be used, one for each channel. The device is not recommended for driving loads below 4 ohms as this may trigger over-current protection.

AW8737 supports 4-16 ohm speakers. Use 4-ohm for maximum output power.

The AW8737 requires minimal thermal management due to its high efficiency and compact thermal design. At typical operating conditions (0.5W output power), the device dissipates less than 50mW of power as heat. The WCSP package has an exposed thermal pad on the bottom that should be connected to the PCB ground plane with multiple vias for heat dissipation. For most applications, the PCB copper area provides sufficient heatsinking to keep the junction temperature within safe limits. The device includes over-temperature protection that will reduce output power or shut down if the die temperature exceeds safe limits. For high ambient temperature applications or continuous high-power operation, ensure adequate PCB copper area and consider airflow if available. Thermal modeling shows the device can operate at full 2W output power up to 85°C ambient temperature with standard PCB designs. For extreme conditions, contact Awinic for thermal design support.

Minimal thermal management needed. Connect thermal pad to ground plane with vias.